Enclosure system shelf

ABSTRACT

A set of one or more shelves is configured to be disposed within an enclosure system of a substrate processing system. The set of one or more shelves includes first upper surfaces disposed substantially in a first plane, carrier alignment features configured to align a carrier on the first upper surfaces, second upper surfaces disposed substantially in a second plane that is above the first plane, and process kit ring alignment features configured to align a process kit ring on the carrier above the second upper surfaces.

RELATED APPLICATION

This application claims benefit of U.S. Provisional Patent Application62/993,518, filed Mar. 23, 2020, and U.S. Provisional Patent Application63/158,259, filed Mar. 8, 2021, the entire contents of which areincorporated by reference herein.

TECHNICAL FIELD

Embodiments of the present disclosure relate to shelves, such as thoseused in association with wafer processing systems, and in particular toenclosure system shelves configured to support process kit rings and/orcarriers for process kit rings.

BACKGROUND

In semiconductor processing and other electronics processing, platformsare often used that use robotic arms to transport objects, such aswafers, between processing chambers, from storage areas (e.g., frontopening unified pods (FOUPs)) to processing chambers, from processingchambers to storage areas, and so on. A processing system, such as awafer processing system, has one or more processing chambers forprocessing of wafers. A gas is used to etch a wafer in a processingchamber (e.g., a wafer is etched while electrostatically clamped inposition in an etch chamber). The robotic arms are to pick up objectsfrom specific locations and transport the objects to specific otherlocations.

SUMMARY

The following is a simplified summary of the disclosure in order toprovide a basic understanding of some aspects of the disclosure. Thissummary is not an extensive overview of the disclosure. It is intendedto neither identify key or critical elements of the disclosure, nordelineate any scope of the particular implementations of the disclosureor any scope of the claims. Its sole purpose is to present some conceptsof the disclosure in a simplified form as a prelude to the more detaileddescription that is presented later.

In an aspect of the disclosure, a set of one or more shelves isconfigured to be disposed within an enclosure system of a substrateprocessing system. The set of one or more shelves includes first uppersurfaces disposed substantially in a first plane, carrier alignmentfeatures configured to align a carrier on the first upper surfaces,second upper surfaces disposed substantially in a second plane that isabove the first plane, and process kit ring alignment featuresconfigured to align a process kit ring on the carrier above the secondupper surfaces.

In another aspect of the disclosure, an enclosure system is of asubstrate processing system. The enclosure system includes a pluralityof surfaces that at least partially enclose an interior volume of theenclosure system, and a set of one or more shelves at least partiallydisposed within the interior volume of the enclosure system. The set ofone or more shelves includes a plurality of carrier alignment featuresconfigured to align a carrier on the set of one or more shelves in afirst plane and a plurality of process kit ring alignment featuresconfigured to align a process kit ring on the carrier in a second planeabove the first plane.

In another aspect of the disclosure, a method includes transporting acarrier supporting a process kit ring to a position above a set of oneor more shelves disposed within an enclosure system of a substrateprocessing system and, responsive to lowering the carrier supporting theprocess kit ring, causing the carrier to align on the set of one or moreshelves via a plurality of carrier alignment features of the set of oneor more shelves.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings in which likereferences indicate similar elements. It should be noted that differentreferences to “an” or “one” embodiment in this disclosure are notnecessarily to the same embodiment, and such references mean at leastone.

FIG. 1 illustrates a processing system, according to certainembodiments.

FIG. 2 illustrates a front view of an enclosure system, according tocertain embodiments.

FIGS. 3A-J illustrates one or more shelves of an enclosure system,according to certain embodiments.

FIGS. 4A-E illustrate a shelf with retaining devices, according tocertain embodiments.

FIG. 5 illustrates a method of using one or more shelves of an enclosuresystem, according to certain embodiments.

FIGS. 6A-H illustrate shelves of enclosure systems, according to certainembodiments.

DETAILED DESCRIPTION OF EMBODIMENTS

Embodiments described herein are related to an enclosure system shelf

A wafer processing system includes a factory interface and a transferchamber. An enclosure system (e.g., FOUP) is mounted to the factoryinterface and processing chambers are mounted to the transfer chamber.Process kit rings are disposed within the processing chambers to protectcomponents of the processing chambers. Over time, process kit ringsbecome worn and are to be replaced.

Robot arms are used to transfer content within the wafer processingsystem. Robot arms are used to transfer wafers from an enclosure systemto one or more processing chambers to be processed and back to theenclosure system. Robot arms are used to transport used process kitrings from processing chambers to an enclosure system and to transportnew process kit rings from the enclosure system to the processingchambers. In some instances, robot arms use carriers (e.g., adaptors) totransfer process kit rings. For example, a carrier is disposed on therobot arm and other content is disposed on the carrier.

Content is to be placed by robot arms in specific locations and is to bepicked up by robot arms from specific locations. In embodiments, anenclosure system secures content (e.g., carriers and/or process kitrings) in specific locations. In embodiments, by securing the content inthe specific locations, an ability of robot arms to pick up the contentfrom source locations is increased, and the ability of the robot arms tothen place the content in specific target locations is also increased.

Error is introduced into the placement of content. Such error can beintroduced by robot error, misalignment of chambers to one another,improper placement of content in storage locations (e.g., in containers)and/or shifting of the content within the storage locations. Forexample, one or more of a local center finding (LCF) device, alignmentdevice, robot arm, or the like introduce error in the placement ofcontent (e.g., carrier supporting a process kit ring) within anenclosure system. In some instances, erroneously placed content is notsubstantially horizontal (e.g., sits up on the edge of a supportstructure) in the enclosure system. In some instances, an enclosuresystem cannot secure erroneously placed content during transportationwhich causes more error in placement of the content, damage to thecontent, and/or damage to the enclosure system. In some instances, arobot arm cannot retrieve erroneously placed content from an enclosuresystem. In some instances, erroneously placed content in the enclosuresystem is transferred in an erroneous orientation (e.g., via the robotarm) and causes damage to the content, damage to the wafer processingsystem, misalignment of the content, and/or erroneous processing of thecontent.

The devices, systems, and method disclosed herein provide one or moreshelves configured to be disposed in an enclosure system (e.g., FOUP) ofa processing system (e.g., wafer processing system, substrate processingsystem, semiconductor processing system). In some embodiments, a singleshelf is configured to support content (e.g., a carrier, a process kitring disposed on a carrier, a placement validation wafer, etc.). Theshelf includes a first portion and a second portion. The first portionincludes a first upper surface in a first plane, a second upper surfacein a second plane above the first plane, first carrier alignmentfeatures, and first process kit ring alignment features. The secondportion includes a third upper surface in the first plane, a fourthupper surface in the second plane, second carrier alignment features,and second process kit ring alignment features. The first and secondcarrier alignment features are configured to align a carrier on (e.g.,contacting, disposed above) the first and third upper surfaces. Thefirst and second process kit ring alignment features are configured toalign a process kit ring on (e.g., contacting, disposed above) thesecond and fourth upper surfaces.

In some embodiments, the first portion and the second portion includeattachment features (e.g., an opening to receive a fastener, a fastener,etc.) configured to attach the shelf to the enclosure system.

In some embodiments, the shelf further includes a third portion disposedbetween the first and second portions, where the third portion includesa third process kit ring alignment feature configured to align theprocess kit ring on the shelf above the carrier. In some embodiments,the first, second, and third portions of the shelf form a “U”-shape,where the first portion is a first side, the second portion is a secondside, and the third portion is a rear side that is disposed between thefirst and second sides. In some embodiments, the first, second, andthird portions of the shelf are integral to each other. In someembodiments, the first, second, and third portions of the shelf areattached to each other.

One or more of the carrier and/or process kit ring alignment featuresinclude a corresponding sidewall. In some embodiments, a sidewallincludes a lower portion that is at about a 100 to 110 degree angle fromthe first plane and an upper portion that is at about a 130 to 140degree angle from the first plane.

In some embodiments, the first and second carrier alignment featuresinclude first sidewalls that are configured to prevent x-directionmovement and yaw movement of the carrier. In some embodiments, the firstand second carrier alignment features first include second sidewallsthat are configured to prevent y-direction movement of the carrier. Insome embodiments, the first and third upper surfaces are configured toprevent z-direction movement, pitch movement, and roll movement of thecarrier.

In some embodiments, the process kit ring alignment features includesidewalls that are configured to prevent yaw movement of the process kitring. In some embodiments, the sidewalls have about a 100 to 110 degreeangle from the first plane. In some embodiments, the carrier isconfigured to prevent x-direction movement, y-direction movement,z-direction movement, pitch movement, and roll movement of the processkit ring.

In some embodiments, the shelf further includes one or more carrierretaining devices configured to secure the carrier to the shelf and oneor more process kit ring retaining devices configured to secure theprocess kit ring to the shelf

In some embodiments, a carrier supporting a process kit ring istransported (e.g., via a robot arm) to a position above the shelfdisposed within the enclosure system (e.g., FOUP). Responsive tolowering (e.g., via the robot arm) the carrier supporting the processkit ring, the process kit ring aligns on the shelf via the process kitring alignment features of the shelf and the carrier aligns on the shelfvia the carrier alignment features of the shelf In some embodiments, theprocess kit ring is secured to the shelf via one or more first retainingdevices and the carrier is secured to the shelf via one or more secondretaining devices responsive to the lowering of the carrier supportingthe process kit ring.

In some embodiments, instead of a single shelf that has a first portionto support a first distal end of content (e.g., a carrier, etc.) and asecond portion to support a second distal end of the content (e.g., thecarrier, etc.), a first shelf is used to support the first distal end ofthe content and a second shelf (e.g., coplanar with the first shelf) isused to support a second distal end of the content.

The devices, systems, and methods disclosed herein have advantages overconventional solutions. The shelf aligns content that is erroneouslyplaced in the enclosure system. In some embodiments, the shelf alignsboth a carrier and a process kit ring in the enclosure system. The shelfaligning content (e.g., carrier and/or process kit ring) prevents damageto the content, prevents damage to the enclosure system, preventstransfer of the content in an erroneous orientation, prevents damage tothe wafer processing system, and prevents erroneous processing of thecontent. The shelf retains the content placed on the shelf whichprevents damage to the content and the enclosure system, preventsmisaligning of the content on the shelf, and the like.

Although portions of the present description refer to process kit ringsand carriers, the present description can be applied to different typesof content. Although portions of the present description refer tosubstrate processing systems, the present description can be applied toother types of systems.

Although portions of the present description refer to a shelf thatincludes different portions that support different portions of content(e.g., process kit rings, carriers, etc.), in some embodiments, thedifferent portions of the shelf can be distinct components that are notconnected to each other. In some examples, a first portion of the shelfthat is configured to support a first distal end of a carrier and thesecond portion of the shelf that is configured to support a seconddistal end of the carrier are two distinct component (e.g., two distinctshelves of a set of shelves that are coplanar).

Although portions of the present description refer to sidewalls ofparticular ranges of slopes, in some embodiments, a curved sidewall maybe used (e.g., that has an average change in rise over run thatapproximates a slope from the particular range of slopes) and/ormultiple slopes may be used on the same sidewall (e.g., where the entiresidewall has an average change in rise over run that approximates aslope from the particular range of slopes).

FIG. 1 illustrates a processing system 100 (e.g., wafer processingsystem, substrate processing system, semiconductor processing system)according to certain embodiments. The processing system 100 includes afactory interface 101 and load ports 128 (e.g., load ports 128A-D). Insome embodiments, the load ports 128A-D are directly mounted to (e.g.,seal against) the factory interface 101. Enclosure systems 130 (e.g.,cassette, FOUP, process kit enclosure system, or the like) areconfigured to removably couple (e.g., dock) to the load ports 128A-D.Referring to FIG. 1, enclosure system 130A is coupled to load port 128A,enclosure system 130B is coupled to load port 128B, enclosure system130C is coupled to load port 128C, and enclosure system 130D is coupledto load port 128D. In some embodiments, one or more enclosure systems130 are coupled to the load ports 128 for transferring wafers and/orother substrates into and out of the processing system 100. Each of theenclosure systems 130 seal against a respective load port 128. In someembodiments, a first enclosure system 130A is docked to a load port 128A(e.g., for replacing used process kit rings). Once such operation oroperations are performed, the first enclosure system 130A is thenundocked from the load port 128A, and then a second enclosure system 130(e.g., a FOUP containing wafers) is docked to the same load port 128A.In some embodiments, an enclosure system 130 (e.g., enclosure system130A) is an enclosure system with shelves for aligning carriers and/orprocess kit rings.

In some embodiments, a load port 128 includes a front interface thatforms a vertical opening (or a substantially vertical opening). The loadport 128 additionally includes a horizontal surface for supporting anenclosure system 130 (e.g., cassette, process kit enclosure system).Each enclosure system 130 (e.g., FOUP of wafers, process kit enclosuresystem) has a front interface that forms a vertical opening. The frontinterface of the enclosure system 130 is sized to interface with (e.g.,seal to) the front interface of the load port 128 (e.g., the verticalopening of the enclosure system 130 is approximately the same size asthe vertical opening of the load port 128). The enclosure system 130 isplaced on the horizontal surface of the load port 128 and the verticalopening of the enclosure system 130 aligns with the vertical opening ofthe load port 128. The front interface of the enclosure system 130interconnects with (e.g., clamp to, be secured to, be sealed to) thefront interface of the load port 128. A bottom plate (e.g., base plate)of the enclosure system 130 has features (e.g., load features, such asrecesses or receptacles, that engage with load port kinematic pinfeatures, a load port feature for pin clearance, and/or an enclosuresystem docking tray latch clamping feature) that engage with thehorizontal surface of the load port 128. The same load ports 128 thatare used for different types of enclosure systems 130 (e.g., process kitenclosure system, cassettes that contain wafers, etc.).

In some embodiments, enclosure system 130 includes one or more sets ofone or more shelves for aligning carriers and/or process kit rings. Insome embodiments, enclosure system 130 includes one set of one or moreshelves for aligning a carrier and/or content (e.g., process kit ring,processing chamber component, etc.) disposed on the carrier. In someembodiments, enclosure system 130 includes three sets of one or moreshelves for aligning carriers and/or process kit rings. In someembodiments, enclosure system 130 includes six sets of one or moreshelves for aligning carriers and/or process kit rings. In someembodiments, enclosure system 130 includes eight sets of one or moreshelves for aligning carriers and/or process kit rings.

In some embodiments, the enclosure system 130 (e.g., process kitenclosure system) includes one or more items of content 110 (e.g., oneor more of a process kit ring, an empty process kit ring carrier, aprocess kit ring disposed on a process kit ring carrier, a placementvalidation wafer, etc.). In some examples, the enclosure system 130 iscoupled to the factory interface 101 (e.g., via load port 128) to enableautomated transfer of a process kit ring on a process kit ring carrierinto the processing system 100 for replacement of a used process kitring.

In some embodiments, the processing system 100 also includes firstvacuum ports 103 a, 103 b coupling the factory interface 101 torespective degassing chambers 104 a, 104 b. Second vacuum ports 105 a,105 b are coupled to respective degassing chambers 104 a, 104 b anddisposed between the degassing chambers 104 a, 104 b and a transferchamber 106 to facilitate transfer of wafers and content 110 (e.g.,process kit rings) into the transfer chamber 106. In some embodiments, aprocessing system 100 includes and/or uses one or more degassingchambers 104 and a corresponding number of vacuum ports 103, 105 (e.g.,a processing system 100 includes a single degassing chamber 104, asingle first vacuum port 103, and a single second vacuum port 105). Thetransfer chamber 106 includes a plurality of processing chambers 107(e.g., four processing chambers 107, six processing chambers 107, etc.)disposed therearound and coupled thereto. The processing chambers 107are coupled to the transfer chamber 106 through respective ports 108,such as slit valves or the like. In some embodiments, the factoryinterface 101 is at a higher pressure (e.g., atmospheric pressure) andthe transfer chamber 106 is at a lower pressure (e.g., vacuum). Eachdegassing chamber 104 (e.g., load lock, pressure chamber) has a firstdoor (e.g., first vacuum port 103) to seal the degassing chamber 104from the factory interface 101 and a second door (e.g., second vacuumport 105) to seal the degassing chamber 104 from the transfer chamber106. Content is to be transferred from the factory interface 101 into adegassing chamber 104 while the first door is open and the second dooris closed, the first door is to close, the pressure in the degassingchamber 104 is to be reduced to match the transfer chamber 106, thesecond door is to open, and the content is to be transferred out of thedegassing chamber 104. A local center finding (LCF) device is to be usedto align the content in the transfer chamber 106 (e.g., before enteringa processing chamber 107, after leaving the processing chamber 107).

In some embodiments, the processing chambers 107 includes or more ofetch chambers, deposition chambers (including atomic layer deposition,chemical vapor deposition, physical vapor deposition, or plasma enhancedversions thereof), anneal chambers, or the like.

Factory interface 101 includes a factory interface robot 111. Factoryinterface robot 111 includes a robot arm, such as a selective complianceassembly robot arm (SCARA) robot. Examples of a SCARA robot include a 2link SCARA robot, a 3 link SCARA robot, a 4 link SCARA robot, and so on.The factory interface robot 111 includes an end effector on an end ofthe robot arm. The end effector is configured to pick up and handlespecific objects, such as wafers. Alternatively, or additionally, theend effector is configured to handle objects such as a carrier and/orprocess kit rings (edge rings). The robot arm has one or more links ormembers (e.g., wrist member, upper arm member, forearm member, etc.)that are configured to be moved to move the end effector in differentorientations and to different locations.

The factory interface robot 111 is configured to transfer objectsbetween enclosure systems 130 (e.g., cassettes, FOUPs) and degassingchambers 104 a, 104 b (or load ports). While conventional systems areassociated with misalignment of content or opening of (e.g., disassemblyof, breaking the seal of, contaminating) a processing system 100 (e.g.,factory interface 101) to align misaligned content, the processingsystem 100 is configured to facilitate alignment of content (e.g., via aset of one or more shelves of an enclosure system 130) without openingof (e.g., disassembly of, breaking the seal of, contaminating) theprocessing system 100 by an operator. Accordingly, in embodiments asealed environment including an interior volume of an enclosure system130 and an internal volume of the factory interface 101 are maintainedduring the alignment of content (e.g., via a set of one or more shelvesof an enclosure system 130).

Transfer chamber 106 includes a transfer chamber robot 112. Transferchamber robot 112 includes a robot arm with an end effector at an end ofthe robot arm. The end effector is configured to handle particularobjects, such as wafers. In some embodiments, the transfer chamber robot112 is a SCARA robot, but has fewer links and/or fewer degrees offreedom than the factory interface robot 111 in some embodiments.

A controller 109 controls various aspects of the processing system 100.The controller 109 is and/or includes a computing device such as apersonal computer, a server computer, a programmable logic controller(PLC), a microcontroller, and so on. The controller 109 includes one ormore processing devices, which, in some embodiments, are general-purposeprocessing devices such as a microprocessor, central processing unit, orthe like. More particularly, in some embodiments, the processing deviceis a complex instruction set computing (CISC) microprocessor, reducedinstruction set computing (RISC) microprocessor, very long instructionword (VLIW) microprocessor, or a processor implementing otherinstruction sets or processors implementing a combination of instructionsets. In some embodiments, the processing device is one or morespecial-purpose processing devices such as an application specificintegrated circuit (ASIC), a field programmable gate array (FPGA), adigital signal processor (DSP), network processor, or the like. In someembodiments, the controller 109 includes a data storage device (e.g.,one or more disk drives and/or solid state drives), a main memory, astatic memory, a network interface, and/or other components. In someembodiments, the controller 109 executes instructions to perform any oneor more of the methods or processes described herein. The instructionsare stored on a computer readable storage medium, which include one ormore of the main memory, static memory, secondary storage and/orprocessing device (during execution of the instructions). The controller109 receives signals from and sends controls to factory interface robot111 and wafer transfer chamber robot 112 in some embodiments.

FIG. 1 schematically illustrates transfer of content 110 (e.g., aprocess kit ring coupled to a process kit ring carrier) into aprocessing chamber 107. According to one aspect of the disclosure,content 110 is removed from an enclosure system 130 via factoryinterface robot 111 located in the factory interface 101. The factoryinterface robot 111 transfers the content 110 through one of the firstvacuum ports 103 a, 103 b and into a respective degassing chamber 104 a,104 b. A transfer chamber robot 112 located in the transfer chamber 106removes the content 110 from one of the degassing chambers 104 a, 104 bthrough a second vacuum port 105 a or 105 b. The transfer chamber robot112 moves the content 110 into the transfer chamber 106, where thecontent 110 is transferred to a processing chamber 107 though arespective port 108. While not shown for clarity in FIG. 1, transfer ofthe content 110 includes transfer of a process kit ring disposed on aprocess kit ring carrier, transfer of an empty process kit ring carrier,transfer of a placement validation wafer, etc.

FIG. 1 illustrates one example of transfer of content 110, however,other examples are also contemplated. In some examples, it iscontemplated that the enclosure system 130 is coupled to the transferchamber 106 (e.g., via a load port mounted to the transfer chamber 106).From the transfer chamber 106, the content 110 is to be loaded into aprocessing chamber 107 by the transfer chamber robot 112. Additionally,in some embodiments, content 110 is loaded in a substrate supportpedestal (SSP). In some embodiments, an additional SSP is positioned incommunication with the factory interface 101 opposite the illustratedSSP. Processed content 110 (e.g., a used process kit ring) is to beremoved from the processing system 100 in reverse of any mannerdescribed herein. When utilizing multiple enclosure systems 130 or acombination of enclosure system 130 and SSP, in some embodiments, oneSSP or enclosure system 130 is to be used for unprocessed content 110(e.g., new process kit rings), while another SSP or enclosure system 130is to be used for receiving processed content 110 (e.g., used processkit rings). The enclosure system 130 is used to align content 110 (e.g.,via a set of one or more shelves in the enclosure system 130) prior totransfer of content 110 via the robot arm and/or prior to transfer ofthe enclosure system 130. The set of one or more shelves aligning thecontent 110 enable the robot arm to correctly remove content 110 fromspecific locations the enclosure system 130, enable the content 110 tobe properly secured in the enclosure system 130 (e.g., enable the set ofone or more shelves to secure the content 110), and enable the enclosuresystem 130 to properly transport content 110.

The processing system 100 includes chambers, such as factory interface101 (e.g., equipment front end module (EFEM)) and adjacent chambers(e.g., load port 128, enclosure system 130, SSP, degassing chamber 104such as a loadlock, or the like) that are adjacent to the factoryinterface 101. One or more of the chambers is sealed (e.g., each of thechambers is sealed). The adjacent chambers are sealed to the factoryinterface 101. In some embodiments, inert gas (e.g., one or more ofnitrogen, argon, neon, helium, krypton, or xenon) is provided into oneor more of the chambers (e.g., the factory interface 101 and/or adjacentchambers) to provide one or more inert environments. In some examples,the factory interface 101 is an inert EFEM that maintains the inertenvironment (e.g., inert EFEM minienvironment) within the factoryinterface 101 so that users do not need to enter the factory interface101 (e.g., the processing system 100 is configured for no manual accesswithin the factory interface 101).

In some embodiments, gas flow (e.g., inert gas, nitrogen) is providedinto one or more chambers (e.g., factory interface 101) of theprocessing system 100. In some embodiments, the gas flow is greater thanleakage through the one or more chambers to maintain a positive pressurewithin the one or more chambers. In some embodiments, the inert gaswithin the factory interface 101 is recirculated. In some embodiments, aportion of the inert gas is exhausted. In some embodiments, the gas flowof non-recirculated gas into the factory interface 101 is greater thanthe exhausted gas flow and the gas leakage to maintain a positivepressure of inert gas within the factory interface 101. In someembodiments, the factory interface 101 is coupled to one or more valvesand/or pumps to provide the gas flow into and out of the factoryinterface 101. A processing device (e.g., of controller 109) controlsthe gas flow into and out of the factory interface 101. In someembodiments, the processing device receives sensor data from one or moresensors (e.g., oxygen sensor, moisture sensor, motion sensor, dooractuation sensor, temperature sensor, pressure sensor, etc.) anddetermines, based on the sensor data, the flow rate of inert gas flowinginto and/or out of the factory interface 101.

The enclosure system 130 allows for aligning of content 110 (e.g.,carrier, process kit ring, or the like) without opening the sealedenvironment within the factory interface 101 and adjacent chambers. Theenclosure system 130 seals to the load port 128 responsive to beingdocked on the load port 128. The enclosure system 130 provides purgeport access so that the interior of the enclosure system 130 can bepurged prior to opening the enclosure system 130 to minimize disturbanceof the inert environment within the factory interface 101.

FIG. 2 illustrates a front perspective view of an enclosure system 200(e.g., enclosure system 130 of FIG. 1), according to certainembodiments. The enclosure system 200 includes one or more shelves 230that are configured to align content, such as a carrier and/or a processkit ring. As shown in FIG. 2, in some embodiments, shelf 230 may have aleft portion to support a first distal end of content, a right portionto support a second distal end of content, and a middle portionconnecting the left portion and the right portion. In some embodiments,shelf 230 may be two or more distinct components (e.g., remote from eachother, not connected to each other, not integral to each other, etc.),such as a left shelf and a right shelf that are not connected to eachother.

The enclosure system 200 includes surfaces (e.g., walls, sidewalls,substantially planar structures, etc.) that at least partially enclosean interior volume 202 (e.g., form a cavity or chamber). In someembodiments, the interior volume 202 is a mini environment (e.g., sealedenvironment). In some embodiments, the interior volume 202 is keptsubstantially particle free (e.g., substantially uncontaminated). Insome embodiments, the enclosure system 200 includes a fan (e.g., at thetop surface) that suppresses any particles in the interior volume 202.In some embodiments, the interior volume is substantially devoid (orcompletely devoid) of one or more of moisture, oxygen, particles (e.g.,dust), or the like.

The surfaces include sidewall surfaces 210A-B (e.g., sidewalls), bottomsurface 212 (e.g., bottom wall), top surface 214 (e.g., top wall), andrear surface 216 (e.g., rear wall). In some embodiments, the surfacesform a clampable tub. One or more of the surfaces (e.g., sidewallsurfaces 210A-B, bottom surface 212, top surface 214, etc.) form a frontinterface. The front interface is configured to interface with (e.g.,seal to) a door for transportation of the enclosure system 200 (e.g.,and to provide a sealed environment). The front interface is configuredto interface (e.g., seal to) a substantially vertical portion of a loadport of a wafer processing system. Responsive to the front interfacebeing sealed to a door or the load port, the enclosure system 200creates a sealed environment (e.g., gases and/or particles do not leaveor enter the enclosure system 200 from the surrounding environmentoutside of the wafer processing system).

In some embodiments, the enclosure system 200 includes a baseplate 220(e.g., adaptor plate) coupled to the bottom surface 212. The baseplate220 is configured to interface with a horizontal portion of the loadport. The baseplate 220 has features (e.g., recesses, receptacles,kinematic interface) to receive kinematic devices (e.g., kinematic pins,precision located pins) of the horizontal portion of the load port. Insome embodiments the baseplate 220 is secured to the bottom surface 212prior to interfacing the enclosure system 200 with the load port. Insome embodiments, the baseplate 220 is secured to the load port and thenthe bottom surface 212 is secured to the baseplate 220. In someembodiments, the enclosure system 200 has a seal (e.g., crushable seal,gasket) to seal one or more openings in the bottom surface 212.

In some embodiments, one or more of an overhead transport flange 222 orat least one handle 224 is coupled to one or more surfaces of theenclosure system 200 for transport (e.g., automated transport, manualtransport, etc.) of the enclosure system 200. In some embodiments, theoverhead transfer (OHT) flange 222 is coupled to the top surface 214. Insome embodiments, the first handle 224A is disposed on a first sidewallsurface 210A and a second handle 224B is disposed on a second sidewallsurface 210B.

In some embodiments, one or more purge adaptors are disposed in thebottom surface 212 (e.g., inserted into openings formed in the bottomsurface 212). The purge adaptors are used to one or more of fill theenclosure system 200 with a gas (e.g., Nitrogen (N₂)), remove gas fromthe enclosure system, pass a gas through the enclosure system 200, orthe like. The purge adaptors extend through the baseplate 220 to fluidlycouple with one or more of a gas or vacuum line (e.g., for purging theenclosure system 200, for creating a vacuum in the enclosure system 200,for filling the enclosure system 200 with a gas, etc.). Each of thepurge adaptors provides a seal at a corresponding opening in the bottomsurface 212 (e.g., to provide a sealed environment). In someembodiments, the enclosure system 200 seals to the load port responsiveto being docked to the load port. The interior volume of the enclosuresystem 200 is configured to be purged via the one or more purge adaptorsprior to opening of the enclosure system 200.

In some embodiments, one or more shelves 230 are at least partiallydisposed within the interior volume 202. In some embodiments, one ormore shelves 230 are completely disposed within the interior volume 202.In some embodiments, the one or more shelves 230 are attached tosidewall surfaces 210A-B. In some embodiments, the one or more shelves230 are attached to one or more support structures (e.g., posts, etc.)that are attached to the enclosure system 200 (e.g., sidewall surfaces210A-B, bottom surface 212, baseplate 220, or the like).

A set of one or more shelves 230 is configured to receive content, suchas a carrier 232 and/or a process kit ring 234. In some embodiments, thecarrier 232 is disposed on a set of one or more shelves 230 and theprocess kit ring is disposed above (e.g., contacting, not contacting)the carrier 232 on the shelf 230. In some embodiments, the carrier 232is disposed on a set of one or more shelves 230 and the process kit ringis disposed on the carrier 232 above the set of one or more shelves 230(e.g., without contacting the set of one or more shelves).

The set of one or more shelves 230 has alignment features and/orsurfaces that are configured to align the content on the set of one ormore shelves 230. If a robot arm places content on a set of one or moreshelves 230 in an incorrect position, the alignment features and/orsurfaces align the content into a correct position. In some embodiments,the set of one or more shelves 230 has one or more retaining devicesconfigured to secure the content to at least one shelf 230 of the set ofone or more shelves 230.

FIGS. 3A-J illustrates a shelf 300 (e.g., set of one or more shelves ora single shelf) of an enclosure system (e.g., FOUP of a wafer processingsystem), according to certain embodiments. Shelf 300 corresponds toshelf 230 of FIG. 2 in some embodiments. FIG. 3A illustrates aperspective view of the shelf 300, according to certain embodiments.FIG. 3B illustrates a front view of the shelf 300, according to certainembodiments. FIG. 3C illustrates a rear view of the shelf 300, accordingto certain embodiments. FIG. 3D illustrates a left view of the shelf300, according to certain embodiments. FIG. 3E illustrates a right viewof the shelf 300, according to certain embodiments. FIG. 3F illustratesa top view of the shelf 300, according to certain embodiments. FIG. 3Gillustrates a bottom view of the shelf 300, according to certainembodiments. FIG. 3H illustrates a top view of the shelf 300 supportinga carrier 330 and a process kit ring 340, according to certainembodiments. FIG. 3I-J illustrate cross-sectional side views of theshelf 300 supporting a carrier 330 and a process kit ring 340, accordingto certain embodiments.

The shelf 300 includes a first portion 310A and a second portion 310B.In some embodiments, the first portion 310A and the second portion 310Bare mirror images of each other. In some embodiments, the first portion310A and the second portion 310B are joined by a third portion 310C. Insome embodiments, the first, second, and third portions 310A-C of thecarrier form a “U”-shape, where the first portion 310A is a first side,the second portion 310B is a second side, and the third portion 310C isa rear side that is disposed between the first and second sides. In someembodiments, the first, second, and third portions 310A-C of the shelf300 are integral to each other. In some embodiments, two or more of thefirst, second, and third portions 310A-C of the shelf 300 are attachedto each other (e.g., via one or more fasteners, via adhesive, viasoldering, via welding, etc.). In some embodiments, two or more of thefirst, second, and third portions 310A-C of the shelf 300 are remotefrom each other (e.g., not attached, not connected, etc.). In someembodiments, first portion 310A is a first shelf and second portion 310Bis a second shelf, where the first and second shelf are coplanar and notconnected to each other (e.g., without a third portion 310C).

The first portion 310A and second portion 310B include a first uppersurface 312A in a first plane, a second upper surface 312B in a secondplane above the first plane, first carrier alignment features 314A, andprocess kit ring alignment features 316A. In some embodiments, the firstportion 310A and the second portion 310B further include second carrieralignment features 314B. In some embodiments, the first portion 310A andthe second portion further include attachment features 318 (e.g.,opening to receive a fastener, a fastener, etc.) configured to attachthe shelf 300 to the enclosure system.

In some embodiments, the shelf further includes a third portion disposedbetween the first and second portions 310A-B. The third portion 310Cincludes a process kit ring alignment feature 316B.

The carrier alignment features 314 are configured to align a carrier on(e.g., contacting, disposed above) the first upper surfaces 312A. Theprocess kit ring alignment features 316 are configured to align aprocess kit ring on the carrier, where the process kit ring is disposedabove the second upper surfaces 312B. In some embodiments, a carrier issupported by the first portion 310A and the second portion 310B and aprocess kit ring is disposed on the carrier without contacting the firstportion 310A and the second portion 310B (e.g., without contacting oneor more shelves 300). In some embodiments, the process kit ring contactsthe first portion 310A and/or second portion 310B responsive to movement(e.g., jostling, shaking, impact, rapid movement, etc.) and the processkit alignment features 316 re-align the process kit ring on the carrier.

One or more of the carrier alignment features 314 and/or process kitring alignment features 316 include a corresponding sidewall. In someembodiments, a sidewall of a carrier alignment feature 314 and/or aprocess kit ring alignment feature 316 is at about a 100 to 110 degreeangle from the first plane. In some embodiments, a sidewall of a carrieralignment feature 314 and/or a process kit ring alignment feature 316includes a lower portion that is at about a 100 to 110 degree angle fromthe first plane and an upper portion that is at about a 130 to 140degree angle from the first plane.

In some embodiments, the carrier alignment features 314A include firstsidewalls that are configured to prevent x-direction movement and yawmovement of the carrier. In some embodiments, the carrier alignmentfeatures 314B first include second sidewalls that are configured toprevent y-direction movement of the carrier. In some embodiments, thefirst upper surfaces 312A are configured to prevent z-directionmovement, pitch movement, and roll movement of the carrier.

In some embodiments, the process kit ring alignment features 316Ainclude sidewalls that are configured to prevent yaw movement of theprocess kit ring. In some embodiments, the sidewalls have about a 100 to110 degree angle from the first plane. In some embodiments, the carrieris configured to prevent x-direction movement, y-direction movement,z-direction movement, pitch movement, and roll movement of the processkit ring (e.g., without the process kit ring contacting the firstportion 310A or the second portion 310B).

Referring to FIG. 3H, the shelf 300 is configured to support a carrier330 and/or a process kit ring 340. The carrier 330 includes a rigid body332 forming openings, fasteners 336 configured to removably attach tothe rigid body 332 via the plurality of openings, and fingers 334configured to be removably attached to the rigid body via the fasteners336 and the openings. The fingers 334 are configured to support content(e.g., process kit ring 340) during transportation of the carrier 330within a substrate processing system. In some embodiments, the processkit ring 340 is contacting the carrier 330 when the process kit ring 340is disposed on the carrier 330. In some embodiments, the process kitring 340 is disposed above the carrier 330 without contacting thecarrier 330 when the process kit ring 340 is disposed on the carrier330. In some embodiments, the process kit ring 340 is disposed above theshelf 300 without contacting the shelf 300 when the process kit ring 340is disposed on the carrier 330 and the carrier is disposed on the shelf300.

Referring to FIG. 3I, the shelf 300 (e.g., set of one or more shelves ora single shelf) is configured to support a carrier 330 and/or a processkit ring 340. The process kit ring alignment feature 316B is configuredto align the process kit ring 340 on the carrier 330 (e.g., above theshelf or set of shelves). The fingers 334 are attached to the rigid body332 of the carrier 330 via fasteners 336. In some embodiments, thefingers 334 support the process kit ring 340 while the carrier 330(e.g., supporting the process kit ring 340) is disposed on the shelf300.

Referring to FIG. 3J, the shelf 300 is configured to align a carrier 330and/or a process kit ring 340 on the shelf 300. The shelf includescarrier alignment features 314 and process kit ring alignment features316. The carrier alignment features 314 include one or more sidewallsand the process kit ring alignment features 316 include one or moresidewalls.

In some embodiments, a sidewall (e.g., of carrier alignment feature314A) of the shelf 300 has one or more facets or is curved. In someembodiments, a sidewall (e.g., of carrier alignment feature 314A) of theshelf 300 is about a 100 to 150 degree angle, about 120 to 150 degreeangle, or about 130-140 degree angle from the first upper surface 312A.In some embodiments, a sidewall (e.g., of carrier alignment feature314A) includes a lower portion that is about a 100 to 110 degree angle(e.g., about 15 degrees from orthogonal) from the first upper surface312A and an upper portion that is at about a 130 to 140 degree angle(e.g., about 45 degrees from orthogonal, about 30 degrees more than thelower portion) from the first upper surface 312A.

In some embodiments, a sidewall (e.g., of process kit ring alignmentfeature 316A) is about a 90 to 150 degree angle, 100 to 150 degreeangle, or 100 to 110 degree angle (e.g., about 15 degrees fromorthogonal) from the second upper surface 312B.

In some embodiments, the sidewalls of the carrier alignment features 314and/or the process kit ring alignment feature 316 provide a capturingramp to allow for a misaligned process kit ring and/or carrier returningfrom the substrate processing system (e.g., from a tool) to be alignedand restrained upon being lowered onto the shelf 300. Proper alignmentof the process kit ring to the carrier is used to properly orient andplace the process kit ring in a processing chamber. Conventionallysystems have improper alignment of the process kit to the carrier whichcauses a misplacement or dropping of the carrier and process kit ring inthe tool. In some instances, a process kit ring removed from aprocessing chamber returns to the enclosure system misaligned (e.g., dueto error of the robot arm, the LCF device, the aligner device, etc.).The shelf 300 aligns process kit rings and carriers that return from thesubstrate processing system misaligned. In some embodiments, the shelf300 restrains the process kit ring and/or carrier for transportation(e.g., on OHT via tool automation).

In some embodiments, all alignment features (e.g., carrier alignmentfeatures 314 and/or the process kit ring alignment feature 316) arecreated from a single piece of material and capturing ramps (e.g.,sidewalls of the alignment features) are used to align misalignedreturning content. In some embodiments, self-actuating hooks (e.g.,retaining devices) are used to secure the content and are locked by toolautomation. In some embodiments, the shelf 300 provides for separationof the process kit ring from the carrier to allow for realignment ofboth via automation.

In some embodiments, the shelf 300 is made from plastic polyethyleneterephthalate (PET). In some embodiments, shelf 300 is a single combspanning one station (e.g., a single shelf supporting a process kit ringand a carrier from a left side of the enclosure system and the rightside of the enclosure system) instead of separate combs per side. Usinga single shelf 300 to support a process kit ring and a carrier on twosides reduces tolerance stack.

In some embodiments, the material from which a shelf 300 is formed issecured (e.g., fixture by four screw holes) and then machined whilebeing secured. In some embodiments, windows (e.g., openings) are cutinto the shelf 300 to reduce weight (e.g., see carrier 430 of FIG. 4B).

In some embodiments, process kit ring alignment feature 316B is used forprocess kit ring alignment, second upper surfaces 312B are used forprocess kit ring centering, and a process kit ring retaining device(e.g., see FIGS. 4A-E) is used for process kit ring restraint. In someembodiments, carrier alignment features 314A-B are used for carrieralignment and a carrier retaining device (e.g., see FIGS. 4A-E) is usedfor carrier restraint.

In some embodiments, the six degrees of freedom of the carrier 330 andprocess kit ring 340 are controlled by the robot arm. In transferringthe carrier 330 and process kit ring 340 to the shelf 300, the robot armtransfers the six degrees of freedom of control to the shelf 300. Insome instances, as the six degrees of freedom are transferred, eachdegree of freedom is not transferred at the same time whichconventionally leads to misalignment of the carrier 330 and the processkit ring 340. In some instances, the robot arm and the shelf are inplanes that are not completely parallel which conventionally leads tomisalignment of the carrier 330 and the process kit ring 340. Thealigning features (e.g., carrier aligning features 314 and process kitring aligning features 316) aligns misaligned carriers 330 and processkit rings 340.

FIGS. 4A-E illustrate a shelf 400 (e.g., shelf 230 of FIG. 2, shelf 300of FIGS. 3A-J) with retaining devices, according to certain embodiments.In some embodiments, features in FIGS. 4A-E have similar or the samefunctionality as features with similar numbering in FIGS. 3A-J.

The shelf 400 includes a first portion 410A (e.g., first portion 310A ofFIGS. 3A-J), a second portion 410B (e.g., second portion 310B of FIGS.3A-J), and a third portion 410C (e.g., third portion 310C of FIGS.3A-J). The first portion 410A and/or the second portion 410B includes afirst upper surface 412A (e.g., first upper surface 312A of FIGS. 3A-J),a second upper surface 412B (e.g., second upper surface 312B of FIGS.3A-J), one or more carrier alignment features 414A (e.g., carrieralignment features 314A of FIGS. 3A-J), one or more carrier alignmentfeatures 414B (e.g., carrier alignment features 314B of FIGS. 3A-J), oneor more process kit ring alignment features 416A (e.g., first processkit ring alignment features 316A of FIGS. 3A-J), and process kit ringalignment feature 416B (e.g., process kit ring alignment feature 316B ofFIGS. 3A-J). In some embodiments, shelf 400 is a set of one or moreshelves. In some embodiments, first portion 410A is a first shelf andsecond portion 410B is a second shelf, where the first shelf and thesecond shelf are remote from each other (e.g., not connected to eachother, not attached to each other, etc.).

In some embodiments, the shelf 400 includes one or more carrierretaining devices 460 (e.g., self-actuating hook to secure the carrier430) and/or process kit ring retaining devices 450 (e.g., self-actuatinghook to secure the process kit ring 440). Upon lowering a carrier 430(e.g., carrier 330 of FIGS. 3H-J) supporting a process kit ring 440(e.g., process kit ring 340 of FIGS. 3H-J) (e.g., via a robot arm 470),the process kit ring 440 engages with (e.g., pushes down) a first endportion of a process kit ring retaining device 450, causing a second endportion of the process kit ring retaining device 450 to retain theprocess kit ring 440. In some examples, lowering the process kit ring440 onto the first end portion of the process kit ring retaining device450 rotates the process kit ring retaining device so that the first endportion is pushed into the shelf 400 (e.g., to be substantially parallelwith the second upper surface 412B) and the second end portion isrotated to a position above at least a portion of the process kit ring440.

Upon lowering the carrier 430 onto the first upper surface 312A, thecarrier 430 engages with (e.g., pushes down) a first end portion of acarrier retaining device 460, causing a second end portion of thecarrier retaining device 460 to retain the carrier 430. In someexamples, lowering the carrier 430 onto the first end portion of thecarrier retaining device 460 rotates the carrier retaining device 460 sothat the first end portion is pushed into the shelf 400 (e.g., to besubstantially parallel with the first upper surface 412A) and the secondend portion is rotated to a position above at least a portion of thecarrier 430.

Referring to FIG. 4C, a robot arm 470 is positioned above the shelf 300.A carrier 430 supporting a process kit ring 440 is disposed on the robotarm 470.

Referring to FIG. 4D, the robot arm 470 lowers the carrier 430supporting the process kit ring 440 so that the process kit ring 440actuates a first distal portion of the process kit ring retaining device450 (e.g., self-actuating hook) which causes the second distal portionof the process kit ring retaining device 450 to be disposed above theprocess kit ring 440 to retain the process kit ring 440 on the shelf400.

Referring to FIG. 4E, the robot arm 470 lowers the carrier 430 so thatthe carrier 430 actuates a first distal portion of the carrier retainingdevice 460 (e.g., self-actuating hook) which causes the second distalportion of the carrier retaining device 460 to be disposed above thecarrier 430 to retain the carrier 430 on the shelf 400.

Referring to FIGS. 4A-E, in some embodiments, the shelf 400 furtherincludes a locking device 480. In some embodiments, the locking device480 locks the carrier retaining device 460 and/or the process kit ringretaining device 450 into a secured position. In some embodiments,closing of a door of the enclosure system (e.g., closing the FOUP door)actuates the locking device 480 to lock the carrier retaining device 460and the process kit ring retaining device 450 into the secured position(e.g., for transportation of the enclosure system).

In some embodiments, first portion 410A includes one or more of acarrier retaining device 460, a process kit ring retaining device 450,and/or locking device 480. In some embodiments, second portion 410Bincludes one or more of a carrier retaining device 460, a process kitring retaining device 450, and/or locking device 480. In someembodiments, first portion 410A and second portion 410B both include oneor more of a carrier retaining device 460, a process kit ring retainingdevice 450, and/or locking device 480.

FIG. 5 illustrates a method 500 of using one or more shelves of anenclosure system, according to certain embodiments. In some embodiments,one or more of operations of method 500 are performed by a robot arm(e.g., robot arm of factory interface robot 111 of FIG. 1, robot arm 470of FIGS. 4B-E) and/or by a controller (e.g., controller 109 of FIG. 1).Although shown in a particular sequence or order, unless otherwisespecified, the order of the processes can be modified. Thus, theillustrated embodiments should be understood only as examples, and theillustrated processes can be performed in a different order, and someprocesses can be performed in parallel. Additionally, one or moreprocesses can be omitted in various embodiments. Thus, not all processesare required in every embodiment.

Referring to method 500 of FIG. 5, at block 502, a carrier supporting aprocess kit ring is transported (e.g., by a robot arm) to a positionabove a set of one or more shelves disposed within an enclosure system.

At block 504, the carrier supporting the process kit ring is lowered(e.g., by the robot arm).

In some embodiments, at block 506, the process kit ring is aligned onthe set of one or more shelves and/or the carrier via process kit ringalignment features responsive to lowing of the carrier. In someembodiments, the process kit ring alignment features include slopedsidewalls that guide the process kit ring into an aligned orientation.

In some embodiments, at block 508, the process kit ring is secured tothe set of one or more shelves via a process kit ring retaining deviceresponsive to lowering the carrier. As the material (e.g., carrier andprocess skit ring) moves down, the weight of the process kit ringactuates the process kit ring retaining device (e.g., process kit (PK)restraint).

At block 510, the carrier is aligned on the set of one or more shelvesvia carrier alignment features responsive to lowing of the carrier. Insome embodiments, the carrier alignment features include slopedsidewalls that guide the carrier into an aligned orientation.

At block 512, the carrier is secured to the set of one or more shelvesvia a carrier retaining device responsive to lowering the carrier. Asthe carrier is deposited into position, the weight of the carrieractuates the carrier retaining device (e.g., the carrier restraint).

At block 514, the carrier retaining device and/or the process kit ringretaining device are locked (e.g., responsive to closing a door of theenclosure system which actuates a locking device). In some embodiments,a FOUP door actuates the locking device to lock both the PK restraintand the carrier restraint. In some embodiments, as the process kit ringand the carrier are lowered, the process kit ring and the carrier areseparated by the set of one or more shelves. This allows the capture andalignment of both the carrier and the process kit ring from anymisalignment introduced by automation during process kit ring removal.In some embodiments, as the process kit ring and the carrier (e.g.,process kit ring disposed on the carrier) are lowered, the carriercontacts the set of one or more shelves and the process kit ring doesnot contact the set of one or more shelves.

In some embodiments, each of the operations of method 500 are performedwhile maintaining a sealed environment (e.g., without opening thefactory interface, without opening the enclosure system).

FIGS. 6A-H illustrate views of enclosure systems 600, according tocertain embodiments. FIG. 6A illustrates a front perspective view of anenclosure system 600, according to certain embodiments. FIG. 6Billustrates a front cross-sectional view of an enclosure system 600,according to certain embodiments. FIG. 6C illustrates a sidecross-sectional view of an enclosure system 600, according to certainembodiments. FIG. 6D illustrates an upper cross-sectional view of anenclosure system 600, according to certain embodiments. FIGS. 6E-Fillustrate a front cross-sectional view of a portion of an enclosuresystem 600, according to certain embodiments. FIGS. 6G-H illustrate anupper cross-sectional view of a portion of an enclosure system 600,according to certain embodiments. In some embodiments, features thathave reference numbers that are similar to reference numbers in otherfigures include similar features and/or functionality as those describedin other figures. In some examples, enclosure system 600 of one or moreof FIGS. 6A-H has similar features and/or functionality as enclosuresystem 130 of FIG. 1 and/or enclosure system 200 of FIG. 2.

Referring to FIG. 6A, enclosure system 600 includes sidewalls 610 (e.g.,sidewalls 610A-B), one or more rear walls, and bottom wall 620.Enclosure system 600 includes an enclosure lid 630 (e.g., removableupper wall, non-removable upper wall, etc.) coupled to (e.g., topsurface mounted, side perimeter mounted) one or more of the walls (e.g.,one or more sidewalls 610 and/or one or more rear walls) to at leastpartially enclose an interior volume of the enclosure system 600. Insome embodiments, the enclosure lid 630 is configured to removablyattach to one or more of the walls.

In some embodiments, the enclosure lid 630 is attached to an overheadtransport component 632. In some embodiments, the enclosure system hasone or more windows (e.g., observation windows). In some embodiments,enclosure lid 630 includes an upper window 634 (e.g., upper observationwindow). In some embodiments, at least one of the rear walls of theenclosure system includes a rear window 636 (e.g., rear observationwindow).

Posts 640 are coupled to the bottom wall 620 (e.g., via a base connector642). Shelves 644 are disposed in the interior volume of the enclosuresystem 600. Each of the shelves 644 may be configured to support acorresponding object (e.g., content 110 of FIG. 1). In some embodiments,each shelf 644 is connected to at least one post 640.

In some embodiments a first set of posts 640 (e.g., a first pair ofposts 640, two posts 640) are coupled to the bottom wall 620 (e.g., viathe same base connector 642) proximate sidewall 610A and a second set ofposts 640 (e.g., a second pair of posts 640, two additional posts 640)are coupled to the bottom wall 620 (e.g., via a different base connector642) proximate sidewall 610B. A set of shelves 644 (e.g., a pair ofshelves 644, two shelves 644, a first shelf 644 and a second shelf 644,coplanar shelves 644) may be used to support an object (e.g., content110). The first shelf 644 may be attached to the first set of posts 640and the second shelf 644 may be attached to the second set of posts 640.A first subset of the shelves 644 and a second subset of the shelves 644may be oriented opposite each other in the interior volume (e.g., are inmirrored locations from each other).

The objects supported by shelves 644 may include a carrier 650, one ormore process kit rings 652 disposed on a carrier 650, a placementvalidation wafer 654, a substrate, and/or the like. In some embodimentsa carrier 650 is disposed on a first shelf 644 and a second shelf 644and one or more process kit rings 652 are disposed on the carrier 650without the process kit rings 652 contacting the shelves 644. Each shelf644 may form a recess to guide the process kit ring 652 into the correctlocation on the carrier 650 responsive to the enclosure system 600 beingmoved (e.g., jostled, moved rapidly).

In some embodiments, the upper window 634 is configured for orientationverification (e.g., automated or manual orientation verification) ofobjects disposed in the interior volume. In some embodiments, the rearwindow 636 is removable for orientation adjustment (e.g., manual orautomated orientation adjustment) of one or more of the objects.

In some embodiments, each of the process kit rings 652 has acorresponding flat portion (e.g., flat interior portion) that isviewable via the upper window 634. In some embodiments, each of theprocess kit rings 652 includes a feature (e.g., notch, perimeter notch,recess, marking, upper surface perimeter notch, etc.) on an uppersurface (or lower surface) of the process kit ring 652 that is viewablevia the upper window 634. In some embodiments, the flat portion and/orfeature (e.g., on an upper surface) of each of the process kit rings 652are viewable via the upper window 634 at the same time (e.g.,simultaneously). In some embodiments, each carrier 650 has a carrierfeature that is viewable via the upper window 634 at the same time. Insome embodiments, the carrier feature of each carrier 650, the featureon the upper surface of each process kit ring 652, and the flat portionof each process kit ring 652 are viewable at the same time via the upperwindow 634. Responsive to the flat portion of a process kit ring 652 notbeing in a correct location or the carrier feature not being in acorrect location, the rear window 636 may be removed to adjustorientation of the process kit ring 652 and/or carrier 650. Responsiveto the feature of the upper portion of a process kit ring 652 not beingviewable via the upper window 634 (e.g., not being in an upwardorientation, being flipped over), the enclosure lid 630 and/or theenclosure door are removed to flip the process kit ring 652.

A corresponding upper surface of each of the posts 640 may be configuredto removably interface with a corresponding component of the enclosurelid 630. In some embodiments, the corresponding upper surface of each ofthe posts 640 forms a tapered recess configured to receive a taperedprotrusion (e.g., fastener, etc.) coupled to the enclosure lid 630 toalign each of the posts 640 with the enclosure lid 630.

Each of the shelves 644 may be configured to align objects (e.g.,content 110 of FIG. 1), such as a carrier 650 and/or a process kit ring652. In some embodiments, each shelf 644 has alignment features and/orsurfaces that are configured to align objects on the shelf 644. If arobot arm places an object on shelf 644 in an incorrect position and/ortransportation of the enclosure system 600 causes movement of theobject, the alignment features and/or surfaces align the object into acorrect position. In some embodiments, a shelf 644 has retaining devicesconfigured to secure the object to the shelf 644.

In some embodiments, the interior volume of the enclosure system 600 isa mini environment (e.g., sealed environment). In some embodiments, theinterior volume of the enclosure system 600 is kept substantiallyparticle free (e.g., substantially uncontaminated). In some embodiments,the enclosure system 600 includes a fan (e.g., at the top surface) thatsuppresses any particles in the interior volume. In some embodiments,the interior volume is substantially devoid (or completely devoid) ofone or more of moisture, oxygen, particles (e.g., dust), or the like.

One or more of the walls of the enclosure system 600 may form or may becoupled to a front interface. The front interface is configured tointerface with (e.g., seal to) a door for transportation of theenclosure system 600 (e.g., and to provide a sealed environment). Thefront interface is configured to interface (e.g., seal to) asubstantially vertical portion of a load port of a substrate processingsystem. Responsive to the front interface being sealed to a door or theload port, the enclosure system 600 creates a sealed environment (e.g.,gases and/or particles do not leave or enter the enclosure system 600from the surrounding environment outside of the substrate processingsystem).

In some embodiments, the bottom wall 620 includes or is coupled to abaseplate (e.g., adaptor plate). The baseplate is configured tointerface with a horizontal portion of the load port. The baseplate hasfeatures (e.g., recesses, receptacles, kinematic interface) to receivekinematic devices (e.g., kinematic pins, precision located pins) of thehorizontal portion of the load port. In some embodiments the baseplateis secured to the bottom wall 620 prior to interfacing the enclosuresystem 600 with the load port. In some embodiments, the baseplate issecured to the load port and then the bottom wall 620 is secured to thebaseplate. In some embodiments, the enclosure system 600 has a seal(e.g., crushable seal, gasket) to seal one or more openings in thebottom wall 620.

In some embodiments, one or more of an overhead transport component 632(e.g., overhead transport flange) or at least one handle 612 is coupledto one or more surfaces of the enclosure system 600 for transport (e.g.,automated transport, manual transport, etc.) of the enclosure system600. In some embodiments, the overhead transfer (OHT) component 632 iscoupled (e.g., attached) to the enclosure lid 630. In some embodiments,handle 612A is disposed on a sidewall 610A and a second handle isdisposed on sidewall 610B.

In some embodiments, one or more purge adaptors are disposed in thebottom wall 620 (e.g., inserted into openings formed in the bottom wall620). The purge adaptors are used to one or more of fill the enclosuresystem 600 with a gas (e.g., Nitrogen (N₂)), remove gas from theenclosure system, pass a gas through the enclosure system 600, or thelike. The purge adaptors extend through the baseplate to fluidly couplewith one or more of a gas or vacuum line (e.g., for purging theenclosure system 600, for creating a vacuum in the enclosure system 600,for filling the enclosure system 600 with a gas, etc.). Each of thepurge adaptors provides a seal at a corresponding opening in the bottomwall 620 (e.g., to provide a sealed environment). In some embodiments,the enclosure system 600 seals to the load port responsive to beingdocked to the load port. The interior volume of the enclosure system 600is configured to be purged via the one or more purge adaptors prior toopening of the enclosure system 600.

Referring to FIG. 6B, enclosure system 600 includes walls that includeone or more of sidewalls 610A-B, rear walls 614A-C, and/or bottom wall620. An enclosure lid 630 is configured to couple to one or more of thewalls of enclosure system 600 (e.g., via one or more fasteners 674, suchas button head screws). The enclosure lid 630 includes an upper window.One or more of the rear walls 614 includes a rear window 636. One ormore of the rear windows 636 are removable to adjust orientation of oneor more of the carriers 650, process kit rings 652, and/or placementvalidation wafer 654. An overhead transportation component 632 may becoupled to the enclosure lid 630.

Posts 640 are coupled to the bottom wall 620 (e.g., via base connector642 and one or more fasteners 674). The posts 640 removably interfacewith enclosure lid 630. In some embodiments, an upper surface of eachpost 640 forms a recess 672 and a component 670 (e.g., fastener 674,protrusion, pilot pin, etc.) of the enclosure lid 630 interfaces withthe recess 672 (e.g., sleeve, plastic sleeve, nylon sleeve, etc.). Insome embodiments, the recess 672 is tapered recess and the component 670is a tapered protrusion to align the enclosure lid 630 with the posts640. Shelves 644 are coupled (e.g., via fasteners 674) to the posts 640.A carrier 650 is disposed on two shelves 644. A placement validationwafer 654 is disposed on two shelves. One or more process kit rings aredisposed on a carrier 650 (e.g., without the one or more process kitrings 652 contacting a shelf 644).

In some embodiments, a shelf 644 includes a sloped surface 680A to alignthe carrier 650 on the shelf 644. In some embodiments, a shelf 644includes a recess 682 (e.g., pocket of deep pocket shelves 644) formedby sloped surfaces 680B-C to align the process kit ring 652 on thecarrier 650 responsive to movement of the enclosure system 600 (e.g.,jostling, rapid movement, etc.).

Referring to FIG. 6C, each shelf 644 may be coupled (e.g., fastened,attached, etc.) via fasteners 674 to two posts 640. The two posts 640are coupled to the bottom wall 620 via the same base connector 642. Insome embodiments, an enclosure door 690 is configured to removablycouple (e.g., attach, clamp, seal, etc.) to one or more of the wallsand/or enclosure lid 630 of the enclosure system 600.

Referring to FIG. 6D, process kit ring 652 has a flat surface 660 (e.g.,flat inside surface, etc.) and/or an upper surface feature 662 (e.g.,notch, marking, recess, etc.) of each of the process kit rings 652 thatare to be viewable via the upper window. Responsive to the flat surface660 not being in a correct location in the view via the upper window,the orientation of the process kit ring 652 is to be adjusted (e.g.,rotated to be located in the correct location). Responsive to the uppersurface feature 662 not being viewable, the process kit ring 652 is tobe flipped (e.g., so that the upper surface feature 662 is orientedupwards instead of downward). In some embodiments, the carrier has acarrier feature 664 (e.g., recess, cut-out) that is disposed proximatethe flat surface 660 of the process kit ring 652. The carrier feature664 is viewable via the upper window of the enclosure lid to determinewhether the carrier 650 is oriented correctly. In some embodiments, thecarrier 650 includes fingers 692 that support the process kit ring 652.

Referring to FIGS. 6E-F, a carrier 650 supporting one or more processkit rings 652 (e.g., process kit rings 652A-B) is to be lowered onto ashelf 644. The shelf is connected to a post 640 via a fastener 674. Insome embodiments, a component 676 further couples the shelf 644 to thepost 640. In some examples, the shelf is connected to the post 640 viaone or more components 676 (e.g., pilot pin, etc.) and then the fastener674 secures the shelf 644 to the post 640.

In some embodiments a set of process kit rings 652 stacked on top ofeach other are supported by carrier 650. In some embodiments, a shelf644 includes a sloped surface 680A (e.g., carrier alignment feature) toalign the carrier 650 on the shelf 644. In some embodiments, a shelf 644includes a recess 682 (e.g., pocket of deep pocket shelves 644) formedby sloped surfaces 680B-C (e.g., process kit ring alignment features) toalign the process kit ring 652 on the carrier 650 responsive to movementof the enclosure system 600 (e.g., jostling, rapid movement, etc.). Insome embodiments, the process kit rings 652 are disposed above or inrecess 682 without contacting shelf 644.

In some embodiments, shelf 644 includes a carrier retaining device 694(e.g., carrier retaining device 460 of FIGS. 4A-E, self-actuating hookto secure the carrier 650). Upon lowering the carrier 650 (e.g.,supporting process kit rings 652, lowering via a robot arm) onto shelf644 (e.g., sloped surface 680A), the carrier 650 engages with (e.g.,pushes down) a first end portion of a carrier retaining device 694,causing a second end portion of the carrier retaining device 694 toretain the carrier 650. The carrier retaining device 694 may rotateabout an axis 696 from a non-securing position to a securing position.In some examples, lowering the carrier 650 onto the first end portion ofthe carrier retaining device 694 rotates the carrier retaining device694 (e.g., about axis 696) so that the first end portion is pushed intothe shelf 644 (e.g., to be substantially parallel with the first uppersurface of shelf 644) and the second end portion is rotated to aposition above at least a portion of the carrier 650. In someembodiments, a locking device (e.g., locking device 480 of FIGS. 4A-E)is configured to insert into a recess 698 (e.g., responsive to securingthe door 690 to the enclosure system 600) to lock the carrier retainingdevice 694 in a non-securing position or into a securing position. Byplacing the carrier 650 on the shelf 644 which rotates the carrierretaining device 694 from a non-securing position (e.g., FIG. 6E) to asecuring position (e.g., FIG. 6F) and securing the door 690 to theenclosure system 600 to insert the locking device into the recess 698,the carrier is secured by the carrier retaining device 694 until thedoor 690 is removed from the enclosure system 600.

Referring to FIGS. 6G-H, the carrier retaining device 694 (e.g., latch,PET latch) may pivot about an axis 696 (e.g., pin). A locking device 622may include a rod 624 (e.g., stainless steel rod), a cap 626 (e.g., tocontact door 690, ultra high molecular weight (UHMW) polyethylene cap,etc.), a guide component 628 (e.g., guide, connector nut, UHMWpolyethylene guide, etc.), and/or a spring 629. In a non-locked position(e.g., without the door 690 secured to the enclosure system 600), thespring 629 is expanded, removing the rod 624 from the recess 698 whichallows the carrier retaining device 694 to move between the securedposition and non-secured position. In a locked position (e.g., with thedoor 690 secured to the enclosure system 600, the spring 629 iscompressed and the rod 624 is in the recess 698 which prevents thecarrier retaining device 694 from moving between the secured positionand the non-secured position (e.g., locking the carrier 650 to the shelf644).

In some embodiments, each shelf 644 includes a carrier retaining device694 and/or a locking device 622. In some embodiments, two shelves 644that are coplanar (e.g., both support the same carrier 650) both includea carrier retaining device 694 and/or a locking device 622. In someembodiments, at least one of the two shelves 644 that are coplanar(e.g., both support the same carrier 650) includes a carrier retainingdevice 694 and/or a locking device 622.

Unless specifically stated otherwise, terms such as “transporting,”“moving,” “lowering,” “causing,” “securing,” “removing,” “placing,”“disposing,” “actuating,” “locating,” “closing,” “locking,” or the like,refer to actions and processes performed or implemented by computersystems that manipulates and transforms data represented as physical(electronic) quantities within the computer system registers andmemories into other data similarly represented as physical quantitieswithin the computer system memories or registers or other suchinformation storage, transmission or display devices. Also, the terms“first,” “second,” “third,” “fourth,” etc. as used herein are meant aslabels to distinguish among different elements and do not have anordinal meaning according to their numerical designation.

Examples described herein also relate to an apparatus for performing themethods described herein. In some embodiments, this apparatus isspecially constructed for performing the methods described herein, or itincludes a general purpose computer system selectively programmed by acomputer program stored in the computer system. In some embodiments,such a computer program is stored in a computer-readable tangiblestorage medium.

The methods and illustrative examples described herein are notinherently related to any particular computer or other apparatus.Various general purpose systems can be used in accordance with theteachings described herein, or a more specialized apparatus can beconstructed to perform methods described herein and/or each of theirindividual functions, routines, subroutines, or operations. Examples ofthe structure for a variety of these systems are set forth in thedescription above.

The preceding description sets forth numerous specific details such asexamples of specific systems, components, methods, and so forth in orderto provide a good understanding of several embodiments of the presentdisclosure. It will be apparent to one skilled in the art, however, thatat least some embodiments of the present disclosure can practicedwithout these specific details. In other instances, well-knowncomponents or methods are not described in detail or are presented insimple block diagram format in order to avoid unnecessarily obscuringthe present disclosure. Thus, the specific details set forth are merelyexemplary. Particular implementations can vary from these exemplarydetails and still be contemplated to be within the scope of the presentdisclosure.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the appearances of the phrase “in oneembodiment” or “in an embodiment” in various places throughout thisspecification are not necessarily all referring to the same embodiment.In addition, the term “or” is intended to mean an inclusive “or” ratherthan an exclusive “or.” When the term “about” or “approximately” is usedherein, this is intended to mean that the nominal value presented isprecise within ±10%.

Although the operations of the methods herein are shown and described ina particular order, the order of operations of each method can bealtered so that certain operations are performed in an inverse order sothat certain operations are performed, at least in part, concurrentlywith other operations. In another embodiment, instructions orsub-operations of distinct operations are in an intermittent and/oralternating manner.

It is understood that the above description is intended to beillustrative, and not restrictive. Many other embodiments will beapparent to those of skill in the art upon reading and understanding theabove description. The scope of the disclosure should, therefore, bedetermined with reference to the appended claims, along with the fullscope of equivalents to which such claims are entitled.

What is claimed is:
 1. A set of one or more shelves configured to bedisposed within an enclosure system of a substrate processing system,the set of one or more shelves comprising: a plurality of first uppersurfaces disposed substantially in a first plane; a plurality of carrieralignment features configured to align a carrier on the plurality offirst upper surfaces; a plurality of second upper surfaces disposedsubstantially in a second plane that is above the first plane; and aplurality of process kit ring alignment features configured to align aprocess kit ring on the carrier above the plurality of second uppersurfaces.
 2. The set of one or more shelves of claim 1, wherein: the setof one or more shelves comprises a first shelf and a second shelf thatare coplanar; the plurality of first upper surfaces comprise a firstupper surface of the first shelf and a third upper surface of the secondshelf; the plurality of second upper surfaces comprise a second uppersurface and a fourth upper surface of the second shelf; the plurality ofcarrier alignment features comprise one or more first carrier alignmentfeatures of the first shelf and one or more second carrier alignmentfeatures of the second shelf; and the plurality of process kit ringalignment features comprise one or more first process kit ring alignmentfeatures of the first shelf and one or more second process kit ringalignment features of the second shelf.
 3. The set of one or moreshelves of claim 2, wherein: the first shelf further comprises one ormore first attachment features configured to attach the first shelf toone or more first components of the enclosure system; and the secondshelf further comprises one or more second attachment featuresconfigured to attach the second shelf one or more second components ofto the enclosure system.
 4. The set of one or more shelves of claim 2,wherein: the one or more first carrier alignment features comprise afirst sidewall; the one or more second carrier alignment featurescomprise a second sidewall; and the first sidewall and the secondsidewall are configured to prevent x-direction movement and yaw movementof the carrier.
 5. The set of one or more shelves of claim 4, wherein:the first sidewall is at about a 120 to 150 degree angle from the firstupper surface; and the second sidewall is at about a 120 to 150 degreeangle from the third upper surface.
 6. The set of one or more shelves ofclaim 4, wherein: the one or more first carrier alignment featurescomprise a third sidewall; the one or more second carrier alignmentfeatures comprise a fourth sidewall; and the third sidewall and thefourth sidewall are configured to prevent y-direction movement of thecarrier.
 7. The set of one or more shelves of claim 6, wherein the firstupper surface and the third upper surface are configured to preventz-direction movement, pitch movement, and roll movement of the carrier.8. The set of one or more shelves of claim 3, wherein: the one or morefirst process kit ring alignment features comprise a fifth sidewall; theone or more second process kit ring alignment features comprise a sixthsidewall; and the fifth sidewall and the sixth sidewall are configuredto align the process kit ring on the carrier.
 9. The set of one or moreshelves of claim 8, wherein: the fifth sidewall is at about a 100 to 110degree angle from the first upper surface; and the sixth sidewall is atabout a 100 to 110 degree angle from the third upper surface.
 10. Theset of one or more shelves of claim 1 further comprising one or morecarrier retaining devices configured to secure the carrier to the set ofone or more shelves.
 11. An enclosure system of a substrate processingsystem, the enclosure system comprising: a plurality of surfaces that atleast partially enclose an interior volume of the enclosure system; anda set of one or more shelves at least partially disposed within theinterior volume of the enclosure system, wherein the set of one or moreshelves comprises: a plurality of carrier alignment features configuredto align a carrier on the set of one or more shelves in a first plane;and a plurality of process kit ring alignment features configured toalign a process kit ring on the carrier in a second plane above thefirst plane.
 12. The enclosure system of claim 11, wherein the set ofone or more shelves comprise a first shelf and a second shelf that arecoplanar.
 13. The enclosure system of claim 11, wherein the plurality ofcarrier alignment features comprise a first sidewall and a secondsidewall, wherein the first sidewall and the second sidewall areconfigured to prevent x-direction movement and yaw movement of thecarrier.
 14. The enclosure system of claim 13, wherein the plurality ofcarrier alignment features further comprise a third sidewall and afourth sidewall, wherein the third sidewall and the fourth sidewall areconfigured to prevent y-direction movement of the carrier.
 15. Theenclosure system of claim 14, wherein the set of one or more shelvesfurther comprises a first upper surface and a third upper surface thatare in the first plane and that are configured to prevent z-directionmovement, pitch movement, and roll movement of the carrier.
 16. Theenclosure system of claim 11, wherein the plurality of process kit ringalignment features comprise a plurality of sidewalls that are configuredto align the process kit ring on the carrier.
 17. The enclosure systemof claim 16, wherein the carrier is configured to prevent x-directionmovement, y-direction movement, z-direction movement, pitch movement,and roll movement of the process kit ring.
 18. The enclosure system ofclaim 16 further comprising a plurality of sets of one or more shelvescomprising the set of one or more shelves, wherein each set of theplurality of sets is configured to support one or more of acorresponding carrier, a corresponding process kit ring, a correspondingplacement validation wafer, or a component of the substrate processingsystem.
 19. A method comprising: transporting a carrier supporting aprocess kit ring to a position above a set of one or more shelvesdisposed within an enclosure system of a substrate processing system;and responsive to lowering the carrier supporting the process kit ring,causing the carrier to align on the set of one or more shelves via aplurality of carrier alignment features of the set of one or moreshelves.
 20. The method of claim 19, wherein, further responsive to thelowering of the carrier supporting the process kit ring, securing thecarrier to a shelf of the set of one or more shelves via one or moreretaining devices of the shelf.